Recruitment

  • Senior RF Chip Design Engineer

    1

    Responsibility:

    1. Responsible for developing the development plan of RF chips and modules according to the product development process;
    2. According to the requirements of product indicators, propose corresponding design plans and make further evaluation of the plan;
    3. Participate in the design and development of RF chips, especially PA and Multi Chip Module;
    4. Perform specific design, simulation, and assist in the completion of integrated circuit wiring design;
    5, participate in the test after the film, design verification, and improve the design;
    6. Analyze and judge the abnormal situation that occurs during the mass production test, find out the cause of the problem and propose a solution to ensure the smooth production of the product.

    Post requirements

    1. Masters degree or above, major in microwave technology, microelectronics and radio;
    2. More than five years experience in CMOS or GaAs RF chip design;
    3, Familiar with RF circuit design skills, familiar with various RF circuit and layout design including PA, Switch, LNA, Mixer, VCO, PLL, master the principle and design of RF transceiver;
    4. Proficiency in the use of ADS, Momentum, HFSS, Cadence and other analytical design tools;
    5. Have a certain understanding of wireless communication systems, such as GSM, WCDMA, LTE, GPS, WLAN, WiFi, WiMax, MIMO, etc.;
    6, with strong communication skills, proficient in English reading and writing.
  • RF chip design engineer

    1

    Responsibility:

    1. Participate in the design and development of RF chips and module components;
    2. Assist senior RF engineers in determining technical solutions and hardware module divisions;
    3. Perform detailed design of the radio frequency integrated circuit and form corresponding documents;
    4. Responsible for post-chip debugging and testing, assisting in overall product testing;
    5. Work closely with Foundry to ensure that the relevant goals of the entire product are achieved on time.

    Post requirements

    1. Masters degree or above, related majors such as microwave technology, microelectronics and radio, should be available in previous years;
    2, need to have RF chip design experience, familiar with the RF chip design process;
    3. Proficiency in operating various commonly used RF test instruments, such as oscilloscopes, signal generators, spectrum analyzers, noise figure analyzers, vector network analyzers, etc.
    4, proficient in RF circuit design skills, including various module circuits in the RF transceiver;
    5, skilled use of ADS, HFSS, Cadence and other analytical design tools;
    6. Have a certain understanding of the wireless communication system;
    7, with strong communication skills, proficient in English reading and writing.
  • Field Application Engineer (Hardware)

    Multiple

    Responsibility:

    1. Design the corresponding RF circuit board according to the technical specifications of the RF chip and the needs of the customer;
    2. Assist the R&D department to complete new product development and commissioning, mass production testing, provide reference and improvement suggestions;
    3, need to understand the performance indicators and test methods of PA, LNA, Switches, Front End Module, and make the corresponding board-level design;
    4. Be able to understand and propose solutions for chips and modules according to customer needs, and timely feedback to the R&D team;
    5, can find and identify problems in the mass production test program and propose solutions to improve the accuracy and effectiveness of mass production testing;
    6. It has considerable coordination ability and can have good cooperation ability with R&D team and mass production test factory.

    Post requirements

    1. Bachelor degree or above, related majors such as electromagnetic field engineering and microwave technology, electronic engineering and radio, should be available in the past;
    2, familiar with the circuit principle, familiar with the RF transceiver system and power amplifier circuit, if you are familiar with the integrated circuit machine test principle and the characteristics of the main test ATE is best;
    3. Have independent RF circuit board design and debugging capabilities, have relevant testing experience, and be proficient in using RF test instruments;
    4, has strong communication skills, proficient in English reading and writing;
    5. Responsible, meticulous, rigorous, and patient.

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